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Equipment & Process Capability

The available process modules in CR1 include the following:

  1. Thin Film Module - Plasma Enhanced Chemical Vapour Deposition (PECVD), Physical Vapour Deposition (PVD), Ebeam Evaporation and Rapid Thermal Processing equipment.

  2. Diffusion Module - Diffusion Furnaces, Drive-in and Ion Implanation equipment.

  3. Dry Etch Module - Reactive Ion Etch (RIE), Inductive-Coupled Plasma (ICP)-RIE, Deep Silicon RIE equipment and Photoresist Asher.

  4. Lithography Module - Coater, Mask Aligner, Developer and Hotplate oven.

  5. Wet Bench Module - Wet bench, Megasonic bench and IPA dryer

  6. Metrology Module - Scanning Electron Microscopy (SEM), Optical Microscope, Stress measurement, Resistivity measurement, Step Profiler, Interferometer and Ellipsometer.

  7. Packaging and Dicing Module - Wire bonding and Wafer dicing​.

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