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Equipment & Process Capability

The available process modules in C2 include the following:

1​ Thin Film Module - Physical Vapor Deposition (PVD), E-Beam Evaporation, Metal Organic Chemical Vapor Deposition (MOCVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma Chemical Vapor Deposition (HDP CVD) and Low Pressure Chemical Vapor Deposition (LPCVD).
​2 Diffusion Module - Rapid Thermal Annealing.
​3 Dry Etch Module - Reactive Ion Etch (RIE), Inductive-Coupled Plasma (ICP), Descum and Dry Stripper.
​4 Wet Bench Module - Acid & Solvent Benches and Fumehood.
​5 Lithography Module - Electron Beam Lithography, Mask Aligner, Priming Oven and Resist Spin Coaters.​
​6 Metrology - Field Emission Scanning Electron Microscope (FESEM), Atomic Force Microscope (AFM), Step Profiler, Ellipsometer and X-Ray Diffractometer.
 


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