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Chapters

Year 2012
  1. A. V. Do, C.C. Boon, M. A. Do, K. S. Yeo, A. Cabuk,, "A 1-V CMOS Ultralow-Power Receiver Front End for the IEEE 802.15.4 Standard Using Tuned Passive Mixer Output Pole" of "VLSI-SOC, IFIP International Federation for Information Processing Book Series,", NA : Springer Boston,, 2012
  2. Xuexin Liu, Hao Yu and Sheldon X.D. Tan, "Analog Mismatch Analysis by Stochastic Nonlinear Macromodeling" of "Analog Circuits: Applications, Design and Performance", NA : Nova Science Publishing, 2012
  3. Yiyu Shi, Yang Shang, and Hao Yu, "IC Package System Integrated Design" of "Advanced Flip-chip Packaging", NA : Springer Publishing, 2012

Year 2011
  1. Hao Yu and Xiwei Huang, "3D IC Design Automation Considering Dynamic Power and Thermal Integrity" of "Three-Dimensional Integration of Integrated Circuits", Edited by C. S. Tan, K.-N. Chen, and S. J. Koester, NA : Pan Stanford Publishing, 2011
  2. M.Vamshi Krishna, Xie Juan, M.A.Do, C.C.Boon, K.S.Yeo and Aaron V.Do, "A 1.8-V 3.6-mW 2.4-GHz Fully Integrated CMOS Frequency Synthesizer for IEEE 802.15.4" of "VLSI-SOC, IFIP International Federation for Information Processing Book Series,", NA : Springer Boston, 2011
  3. Yiyu Shi, Hao Yu and Lei He, "Noise Driven In Package Decoupling Capacitor Optimization for Power Integrity" of "Recent Advancements in Modeling of Semiconductor Processes, Circuits and Chip-Level Interactions", Edited by Rasit Onur Topaloglu, and Peng Li, NA : Bentham Publishing, 2011
  4. V. Tarateeraseth, K. Y. See and F. Canavero, "Noise Source Impedance Measurement in Switched-Mode Power Supply" of "Electromagnetic Interference Issues in Power Electronics and Power Systems,", NA : Bentham Science, 2011

Year 2010
  1. Hao Yu and Xiwei Huang, "3D IC Design Automation Considering Dynamic Power and Thermal Integrity" of "Three-Dimensional Integration of Integrated Circuits", NA: Pan Stanford Publishing, 2010
  2. Yiyu Shi, Hao Yu and Lei He, "Noise Driven In Package Decoupling Capacitor Optimization for Power Integrity" of "Recent Advancements in Modeling of Semiconductor Processes, Circuits and Chip-Level Interactions", NA: Bentham Publishing, 2010
  3. V. Tarateeraseth, K. Y. See and F. Canavero, "Noise Source Impedance Measurement in Switched-Mode Power Supply" of "", NA: Bentham Science, 2010
  4. X. Shi and K. S. Yeo, "On-Chip Interconnects of RFICs" of "Solid State Circuits Technologies", Edited by Jacobus W. Swart (ed.), NA: INTECH , 2010, pp. 239-262, 2010

Year 2009
  1. Kaixue Ma, Leyu Zhang and Kiat Seng Yeo,, "Advanced Filter Development for WiMAX applications" of "WIMAX New Developments", Edited by Upena D Dalal and Y P Kosta, NA: INTECH Publication, 2009, pp. 167-182, 2009
  2. Tan Cher Ming, "Reliability Assessment of Integrated Circuits and its Misconception" of "Integrated Circuits, Photodiodes and Organic Field Effect Transistors", Edited by Robert McIntire and Pierre Donnell, NA: Nova Publisher, 2009, pp. 45-68, 2009

Year 2008
  1. Shan Jiang, Manh Anh Do and Kiat Seng Yeo, "A CMOS Mixed-Mode Sample-and-Hold Circuit for Pipelined ADCs" of "VLSI-SoC: Research Trends in VLSI and Systems on Chip, IFIP International Federation for Information Processing Book Series", United States: Springer Boston, 2008
  2. M. Z. Tong, Y. P. Zhang, "Design and Analysis of Integrated-Circuit Package Antennas (ICPA) and Filters (ICPF) for Highly Integrated Wireless Transceivers" of "Signal Integrity Engineering for Integrated Microwave and High Speed Circuits", NA:, 2008
  3. Yuanjin Zheng , Rajinder Singh and Yong-Ping Xu, "Pulse-Based UWB Integrated Transceiver Circuits and Systems" of "Ultra Wideband: Circuits, Architectures and Systems", NA:Springer, 2008
  4. Tan Cher Ming, Nagarajan Raghavan, "Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing" of "Simulated Annealing", NA: IN-TECH, 2008
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